Business News
Announcing the Spring 2013 BIA Annual Conference, Featuring Plant Tours from Three Top Graphic Finishing Companies
Tuesday 23. October 2012 - The Binding Industries Association, in conjunction with Printing Industries of America, is pleased to announce the spring 2013 BIA Annual Conference, April 8-10 at the Indianapolis Marriott Downtown in Indianapolis, Indiana. This conference is the premier education and networking event of the year for binders, graphic finishers, custom loose-leaf manufacturers, and suppliers to those industries.
The 2013 BIA Annual Conference invites the binding industry to “Branch Out” to new opportunities, contacts, technologies, and markets. The spring conference will feature experiential plant tours from top-performing companies, D.E. Baugh Company, Eckhart & Company Inc. and Ross Gage, Inc.
The plant tours will offer attendees firsthand experience in innovative graphic finishing, binding and loose-leaf methods.
The D.E. Baugh Company, provider of quality graphic services, is one of the Midwest’s top foil stamping and graphic finishers, with a list of services including foil stamping, embossing, debossing, diecutting, UV coating, film laminating, remoistenable glue stripping, folding and gluing, and other special processes. This company has been recognized by the Printing Industries of America Premier Print Awards with a Best of Category Award for Finishing Techniques.
Founded in 1918, Echkart & Company is a leading resource for the mechanical binding, case binding, eco perfect binding, as well as information packaging solutions nationwide. Their eco-friendly product line consists of binders that are 100% biodegradable, except for the metal ring.
Ross Gage, Inc. is the industry leader in providing quality indexing solutions to printers and publishers worldwide. This company provides thumb cut, European thumb cut and step cut indexing in many styles. The Ross Gage Inc. facility is equipped with state-of-the-art computer-assisted indexing equipment to meet and exceed production and delivery requirements.