Finishing & Screen Printing

Heidelberg to Exhibit Diecutter at IADD/FSEA Odyssey

Monday 02. May 2011 - Participants will learn techniques for reducing makeready and cutting downtime while increasing both productivity and profits

Heidelberg USA will be among the exhibitors during the IADD/FSEA Odyssey 2011 May 4-6 at the Nashville Convention Center in Nashville, Tenn. Heidelberg will be on hand to demonstrate its Varimatrix 105 CS diecutter, as well as to offer its considerable converting expertise to attendees.
“Heidelberg is an enthusiastic longtime supporter of the IADD/FSEA Odyssey. Unlike a typical trade show, this unique, hands-on event offers shop floor and production personnel an extensive lineup of technical and education sessions designed to advance their working knowledge of the diecutting industry,” said Chris Raney, Vice President Postpress Packaging for Heidelberg USA.
On Thursday, May 5 attendees are invited to take part in Heidelberg’s session on “Gaining Productivity and Efficiency with High-Speed Die cutting” from 3:30 to 4:15 p.m. in the Techshop. Participants will learn how to reduce makeready times and equipment downtime in favor of increased productivity and profitability. This program will use real world examples to show attendees how specific techniques can translate into actual time savings on press.
Heidelberg’s 41″ entry-level Varimatrix 105 CS (cutting and stripping) is a versatile, cost-effective diecutting solution for the commercial and package printing markets. The Varimatrix cuts and embosses paper from 80 gsm, board and solid board up to 1400 gsm, and corrugated board up to 4 mm thick at speeds to 7500 sheets per hour with a maximum cutting force of 331 tons.
Presented by the International Association of Diecutting and Diemaking (IADD) and the Foil & Specialty Effects Association (FSEA), the two-day program combines technical and educational sessions with an opportunity to view the widest range of products and services specific to diecutting, diemaking, foil-stamping/embossing, and folding/gluing processes.

http://www.heidelberg.com
Back to overview