Consumables

CoorsTek Introduces New Design Guide for Thick-Film Ceramic Substrates

Tuesday 25. March 2008 - Several enhanced processing features, updated laser machining standards, new materials, and easier-to-read format is immediately downloadable on the CoorsTek.com website.

CoorsTek, a large technical ceramics manufacturer and long-time provider of electronic components, today released the latest version of its widely used design guide for thick-film ceramic substrates. The first significant update in several years, this guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates.

Two separate design specifications, one for laser machining and the other for thick-film ceramic substrates, have been combined into one completely updated and comprehensive guide. New features include smaller hole and slot sizes (down to 0.003″ [0.0762 mm]), additional substrate thickness offerings (up to 0.140″ [3.556 mm]), laser pulse depth and spacing tolerances, special edge treatments (SilkEdge(TM) finish and SmoothEdge(TM) finish), additional materials (DuraStrate(TM) substrates, MidFilm(R) substrates, economy grade substrates), comprehensive material properties charts, easier-to-understand camber design specifications.

“We took a number of extra steps to ensure this guide would be thoroughly useful to the electronic engineer,” states Andrew Golike, Technical Product Manager for CoorsTek. “It’s designed to ease the specification process for our customers — especially for new and developing electronics markets,” he continued.