Mondi, a leader in the production of sustainable packaging and paper, announces that it has entered into an agreement to acquire the German, Benelux and UK corrugated converting and solid board operations of Schumacher Packaging1 for an enterprise value of 634 million.
Every autumn, Shanghai becomes an international marketplace and forum for the packaging industry in Asia and beyond. Complex solutions for processing and packaging are in high demand here, and more and more companies, also from Europe and America, are attending swop.
PACK EXPO is one of the largest packaging and processing conventions in North America with over 45,000 expected attendees and 2,600 exhibitors registered to attend this years convention November 3 – 6, 2024 in Chicago, IL.
Mitsubishi Electric Automation, Inc. is maintaining its attendance at the PACK EXPO show in Chicago, IL, this year to demonstrate new and exis- ting automation solutions for consumer-packaged goods and life sciences customers and OEMs.
Over 250 exhibitors will be participating including HP & TechNova Imaging Systems, Avery Dennison, GEW, Multitec, Monotech Systems, RK Label Printing Machinery, Jindal SMI, Vinsak, Weldon Celloplast, Domino Printech, Konica Minolta India and Maxcess India.
The deal aims to develop joint international promotion and step up cross-selling activities for their trade fair portfolios, including the Propak and Fispal platforms operated by Informa Markets and the trade fairs organised by Ipack Ima.
Originally launched over a decade ago as Packaging Innovations & Luxury Packaging London, the event has evolved into a dynamic platform for brands, packaging designers, technologists, and suppliers to connect and innovate.
