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Packaging

BW Packaging to showcase next-generation packaging solutions at PACK EXPO International

Monday 14. October 2024 - BW Packaging, Barry-Wehmillers packaging machinery group, will showcase its latest solutions in food and beverage packaging machinery in booth S-2100 at PACK EXPO International, held November 3 to 6 in Chicago.

Booth S-2100 to exhibit Thiele UltraStar G2 Bagger, Hayssen R300 Flow Wrapper and OpView HMI
Attendees visiting BW Packaging’s booth will find offerings from its three operating divisions: BW Filling & Closing, BW Flexible Systems and BW Integrated Systems. Offerings include the new Thiele UltraStar G2 Bag Filler, the new Hayssen R300 Flow Wrapper and enhancements on the Angelus seamers, Burt labelers, Sleevit shrink sleeve labelers and Pneumatic Scale filling equipment. All enhancements have been centered on improving the customer experience to deliver operational efficiency and increased performance.
“We value partnering with our customers to help them overcome their unique challenges and achieve success,” said Rachana Creeth, Group President of BW Packaging. “At PACK EXPO, we’re excited to connect with customers, understand their needs and demonstrate how our latest solutions can solve their problems and drive real results.”
The new Thiele UltraStar G2 Bag Filler, which will make its debut at PACK EXPO International, is a second-generation version of BW Flexible Systems’ renowned UltraStar bagger. This solution is known throughout the packaging industry for its reliability in packaging pet food, rice, grains and agricultural products. The updated G2 design offers brand owners and co-packers enhanced accessibility for maintenance, increased uptime for smoother operations and seamless integration with existing production lines.
BW Flexible Systems’ new Hayssen R300 Flow Wrapper will also make its debut at PACK EXPO International. This hand-fed flow wrapper provides a simple and user-friendly experience for operators, with innovative features that allow for easy changeovers and automated adjustments to maximize uptime. The Hayssen R300 is ideal for flow wrapping baked goods like single cookies, brownies, Danishes, croissants, small pies, whoopie pies, crispy rice treats and more.
Both new machines, and all other machines exhibited at booth S-2100, will feature BW Packaging’s new award-winning OpView HMI. This user-friendly HMI empowers consumer packaged goods companies to overcome operational challenges related to the scarcity of skilled labor. Regardless of their experience level, operators can use the OpView HMI’s smartphone-like interface to easily set up, operate and troubleshoot a variety of packaging solutions, including fillers, closing equipment, labelers, and end-of-line and fully integrated systems. The OpView HMI’s familiar, intuitive interface simplifies operator training, resulting in greater productivity for all BW Packaging customers.
“The OpView HMI is intuitive, adaptable and designed to solve a growing customer challenge: operator turnover,” said Joe Ambrose, Director of Digital Innovation at BW Packaging. “We’re excited to demonstrate at PACK EXPO how this new HMI enhances the operator experience and supports future growth for our customers.”
Demos will be held at booth S-2100 daily for visitors who are interested in seeing how the new OpView HMI complements the many advantages of BW Packaging’s Sleevit labelers, Angelus seamers, Hayssen vertical form-fill-seal baggers and flow wrappers, Pneumatic Scale fillers and cappers, and Thiele bag filler machines.

www.bwpackaging.com
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Das Large-Format-Geschäft behauptet sich erfolgreich im Rahmen der herausfordernden gesamtwirtschaftlichen Rahmenbedingungen und die Druckdienstleister begegnen ihnen mit kreativen Applikationen und vor allem mit einer gehörigen Portion an Anpassungsfähigkeit und der Bereitschaft, die eigenen Prozesse neu zu überdenken. Wir sprachen mit Mike Boyle, Senior Vice President of HP Large Format Go-To-Market, über Differenzierungsmög- lichkeiten, das vorherrschende Automatisierungspotenzial im LFP-Markt und neue Marktchancen.......