Packaging
DuPont Circuit & Packaging Materials Opens New Technical Lab in China
Tuesday 23. March 2010 - The CPM Shanghai Team attending the new Shanghai lab opening. In light of the skyrocketing growth of the electronics industry in China, DuPont Circuit & Packaging Materials (CPM) opened its new lab in Shanghai, China.
Located in the DuPont China R&D Center, the new lab features advanced facilities including equipment designed for testing and evaluating materials and products for use in rigid and flexible printed circuit board (PCB) and wafer-level packaging (WLP) applications. This multi-functional lab will enable faster and more efficient technical support for CPM customers in the electronics industry in China, and provide a facility for new product development and process evaluation.
“DuPont is bullish about the Greater China markets strong demand for electronic products,” said Peter Irvine, global business director, DuPont Circuit & Packaging Materials. “The maturity of 3G technologies and smart phones, the penetration of low-cost and lightweight notebook computers, and the governments Home Appliances to Rural Area Subsidy policy have all fueled prosperity in Chinas electronics industry. In response to the market growth in Asia, we chose Shanghai to establish this technical lab, where we look forward to better meeting the market demand by localizing technical services and providing real-time technical response to our customers.”