Inkjet & Digital Printing
DNP and Unimicron to Establish Printed Wiring Board Joint Venture
Wednesday 09. April 2008 - Dai Nippon Printing Co., Ltd. (DNP) and Unimicron Technology Corporation (Unimicron,) the globally renowned Taiwan based maker of printed wiring boards, are pleased to announce an agreement on the establishment in late June 2008 in Hong Kong, of UD Alliance Technology Limited, a joint venture between the two companies, which will specialize in the manufacturing and marketing of printed wiring boards based on B2itTM DNPs unique buildup board manufacturing technology.
Demand for high function, high density printed wiring boards is forecast to see further expansion going forward, in line with the spread in high function mobile phones in recent years. In many instances, manufacturing of mobile phone terminals is carried out in China and the Asian region, and there are increasing calls for printed wiring board makers to make it possible to answer that demand in a timely fashion from a location closer to the factories of the mobile terminal makers, which serve as their clients.
The new company will sign a patent license agreement covering B2itTM technology with DNP, and manufacture and market printed wiring boards based on this technology. The new company will contract manufacturing to the Unimicron factory in Kunshan, China, and will market end products to DNP and Unimicron in the first instance.
In addition to helping DNP strengthen its production system for printed wiring boards based on B2itTM, and further expand its business, by providing B2itTM related manufacturing technology support to Unimicron, the establishment of this new company will also pave the way for the global standardization of B2itTM technology, itself. As far as Unimicron is concerned, adopting B2itTM technology will help the company to strengthen its production system for high function, high density printed wiring boards, and Unimicron plans to enhance its cost reduction effect through mass production.
[Overview of the New Company]
Company name : UD Alliance Technology Limited
Location : Hong Kong
Paid in capital : HKD 40 million
Investment ratio : Unimicron 66.5%, DNP 33.5%
To be established : Late June 2008
Representative Directors : Unimicron will send in two directors, and DNP one.
Business content : Business content: The manufacture and marketing of printed wiring boards based on B2itTM technology.
[Overview of DNP]
Head quarters: 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo, Japan
Paid in capital: ¥114,464 million
President: Yoshitoshi Kitajima
Dai Nippon Printing Co., Ltd (DNP) is the worlds largest comprehensive printing company with approximately 38,000 employees and annual Group sales of ¥1.5578 trillion. Beginning with printing, DNP operates a broad array of businesses, including commercial printing, smart cards, business forms, networking ventures, and the production of electronics related materials. In the electronics segment, DNP manufactures products for displays such as LCD color filters, and semi-conductor materials, including photomasks, printed wiring boards, and package related materials.
For further information, please visit http://www.dnp.co.jp/
[Overview of Unimicron Technology Corporation]
Head quarters:
No.38, Hsing Pong Road, Kwei Shan Industrial Park, Tao Yuan, Taiwan
Paid in capital: $325 million
Representative Director: T.J.Tseng
Unimicron Technology Corp. (Unimicron) is the worlds largest manufacturer of printed wiring board for use on mobile phones and the top 3 PWB producing company with turnover of US$1.5 billion in 2007. Unimicron supplies a broad range of PWB solutions including advanced PWB (which contributed to 70% of its turnover such as IC carrier and HDI PWB) as well as conventional PWB with manufacturing bases in Taiwan and China.
For more information, please visit http://www.unimicron.com/
[B2itTM Technology]
“B2itTM” is a DNP’s unique technology for buildup printed wiring board, which connects adjacent conductive layers by the bumps made of a high conductivity paste, formed by screen printing and penetrated insulating layer. As there is no plated through hole for electrically connecting between the conductive layers, that leaves a broader area on which to mount parts, and as the wiring layout can be freely carried out throughout all the layers this technology also has the characteristic of allowing for broad latitude in wiring design.
* Product price, specification and service content listed in this news release are as of time of going to press. This data may change without notice. We apologize for any inconvenience.