Packaging

Labelexpo Asia 2023 showcases vibrant industry

Tuesday 02. January 2024 - The first edition of Labelexpo Asia since 2019 has closed on a high note, with a total of 380 domestic and international exhibitors taking part in the show, which took place between 5-8 December at Shanghai New International Expo Centre (SNIEC).

Spread across three halls and covering 32,000 sqm of floor place, this year’s show celebrated its 20th anniversary and featured new product launches focused on flexo, offset and digital press technologies, flexible packaging and Radio Frequency Identification (RFID) technology.
This year’s show saw a total of 26,742 visitors from 93 countries attend the four-day show, compared to 23,636 visitors from 90 countries at the 2019 edition, an increase of 13.1%. Countries such as South Korea, Malaysia, Indonesia and India were particularly well represented with large visitor delegations.
Demonstrating the strength of flexo technology at this show, Spande presented its new AC-series mid-web flexo packaging production line and Hongsheng launched its first inline flexo press, the HSR-340. Hontec launched its new FlexiCon 8-color inline flexo press and Taiyo its servo-driven inline STF-340 flexo press, equipped with chill drums to handle a wide range of materials.
Also highlighted was new intermittent offset printing technology, with Wanjie launching its WJPS-450 shaftless offset press, Shanghai Labelmaster Machinery its LM350 intermittent UV-offset press and Zonten showing the ZTJ-330/520/680 intermittent offset press with auto register.
New digital and hybrid press technology was strongly represented. Weigang launched its first digital press, the WG S350, and Flora showed its J-350 Pro digital press in a six-channel configuration. Pullisi launched its DPIM-330F digital press, available in widths up to 520mm.
Global digital press suppliers also had a significant presence, with Konica Minolta launching in the Chinese market, its AccurioLabel 400 technology and Durst showing its entry-level Tau 330 RSC-E. HP Indigo presented the Digital Pouch Factory which demonstrated the complete process of prepress workflow, printing, lamination, and manufacturing of stand-up pouches.
Other show features included the Smart Label Trail, which gave converters insight into RFID technology trends, practical applications and how they can set up their own RFID converting operation. Two expert-led Label Academy-hosted master classes covered the topics of self-adhesive label technology and sustainable labeling.
Jade Grace, managing director, Labelexpo Global Series said: “We have just delivered a successful Labelexpo Asia 2023, with this year being particularly significant as we came together to mark the show’s 20th anniversary. The feedback we have received from exhibitors and visitors alike has proven that the show continues to be a key driver in generating business growth as well as being an essential platform for developing new professional connections.
“The China market is vibrant and dynamic, there was a lot of business done on the show floor, and a lot of knowledge shared throughout the four days. Thank you to our exhibitors who brought the latest technology to the show, fully committing to growing and supporting the industry. Thank you also to all who visited from 93 countries, the China Packaging Association and all our media partners.”
Kevin Liu, China project director, Labelexpo Global Series added: “I’m delighted with the success of this year’s Labelexpo Asia, marking 20 years of a truly special show for the region. The trends towards short run flexible packaging and RFID technology showcased at the show have brought about new opportunities for label converters in China and the Asia Pacific region.
“Our two show features on the Digital Pouch Factory and Smart Label Trail are a testament to the demand for these new technologies. It is also further proof that China is rapidly becoming an all-round key market for the labels and package printing industry in an increasingly competitive global landscape.”
Roy Xu, HP industrial print general manager, Greater China said: “In the 20th anniversary of Labelexpo Asia, HP brought a variety of label packaging digital presses, as well as value-added services, workflow excellence and brand innovation solutions to meet the customers’ demand for digital, intelligent and sustainable growth.
“In the Digital Pouch Factory, HP offered a complete turnkey solution for users who want to explore the flexible packaging market. At the same time, we launched Indigo 200K digital press with a combination of online and offline, which received lots of interest from potential customers.
“Thanks again to the organizer for building such a professional platform to connect suppliers and customers and advancing the industry development.”