Packaging
Labelexpo Asia 2023 set for vibrant return next week
Friday 01. December 2023 - Visitors to Labelexpo Asia 2023 will see live demonstrations of new flexo, offset and digital press technologies, as well as feature areas focusing on flexible packaging and Radio Frequency Identification (RFID) technology.
Momentum is building for Labelexpo Asia 2023, Asia’s largest label and packaging printing show which is set to open its doors at the Shanghai New International Expo Center (SNIEC) on 5-8 December.
This year’s show will celebrate its 20th anniversary and will host more than 380 exhibitors at Shanghai’s SNIEC exhibition centre when the show returns next week.
Visitors to Labelexpo Asia 2023 will see live demonstrations of new flexo, offset and digital press technologies, as well as feature areas focusing on flexible packaging and Radio Frequency Identification (RFID) technology.
The Digital Pouch Factory is a new show feature for Labelexpo Asia 2023 which focuses on short run flexible packaging. HP Indigo showcases the 25K mid-web digital press along with a Zhoutai AMD350LMSC solventless lamination machine, and AMD350LMSC bag making machine with workflow software provided by Hybrid.
Additionally, HP Indigo will host an exclusive event on 6 December, when the company runs an online demonstration of its new HP Indigo 200k mid-web press, a faster and more productive upgrade to its 25k press for flexible packaging and shrink sleeve applications.
On 4 December, Labelexpo Asia 2023 will also provide a platform for shared learning throughout the label and packaging industry by jointly hosting the International Label Printing Summit with the China Packaging Federation. Label Academy master classes on self-adhesive label technology and sustainability will also run during the show.
This year’s show sees a strong focus on RFID through the Smart Label Trail, giving converters insight into RFID technology trends, practical applications and how they can set up their own RFID converting operation. Participants in the Smart Label Trail include: Muehlbauer Technologies (WUXI) Co. Ltd, Avery Dennison, Shenzhen Hadesheng Precision Technology Inc. Ltd, Shandong Hoaco Automation Technology Co. Ltd, Shenzhen Wing Singa Automation Equipment Co. Ltd, Shanghai Guanzhong Printing Technology, Beijing HWA-TECH Information System Co. Ltd, Voyantic, Shenzhen Chankey Intelligent Electronic Machinery Co. Ltd, Postek Electronics Co. Ltd, Shanghai Kingloop Technology Co. Ltd, Xiamen SDIOT Technology Co. Ltd, Dongguan OSRFID, Shenzhen Yuanmingjie Technology Co. Ltd, Compass Greentech Limited, Nanning XinGeShan Electronic Technology Co. Ltd, Guangzhou Chili Automation Equipment Co. Ltd, ADA (Guangdong) Intelligent Equipment Co. Ltd and Zhejiang Leidan Technology Co. Ltd.
There will also be a dedicated forum on RFID/smart label innovation looking at how RFID technology is transforming the supply chain and the practical steps in manufacturing and testing RFID labels.
Flexo technology makes a strong return at Labelexpo Asia 2023 with suppliers including Weigang, Spande and Hongsheng launching new machines.
To coincide with the celebration of Labelexpo Asia’s 20th anniversary, the first Label Industry China Awards will take place on the evening of 6 December at the Kerry Pudong hotel in Shanghai. The awards aim to recognize organizations and individuals in China who have excelled in the label and package printing sector through innovation and best practice.
Kevin Liu, China Project Director, Labelexpo Global Series said: “We’re looking forward to welcoming all visitors and exhibitors to the 20th anniversary of Labelexpo Asia next week, a truly special milestone. This year’s show will give visitors the opportunity to not only network with the world’s leading industry suppliers but also expand their technical knowledge and learn new skills to drive their businesses forward.”
Jade Grace, Managing Director, Labelexpo Global Series commented: “We’re delighted to be back in Shanghai for Labelexpo Asia 2023, after a 4 year wait. Visitors can expect an exciting show of over 32,000 square meters where they will see more than 380 domestic and international exhibitors present a burst of new technology and products that are making an impact in the label and package printing industry today.
“RFID label technology is a strong focus this edition, as smart labels make huge inroads in the Chinese market. The country is the main producer of ultra-high frequency RFID labels, with production accounting for approximately 80% of the global market share.
“China has grown to become one of the largest and fastest growing labels and package printing market in the world. This year’s show marks 20 years of Labelexpo Asia here in Shanghai. It is very exciting to see the evolutionary platform this show has become – a real showcase of homegrown digital printing technology, material science and advancements in sustainability.”