Packaging
Thimm Group Wins Prestigious Awards With Highcon Technology
Wednesday 28. October 2020 - THIMM packndisplay recently won no less than five awards in the prestigious OBAL ROKU packaging competition for Czech and foreign companies involved in an interesting packaging solution. The company is also on the shortlist for the Jury Award - the best of the best - for its Highcon digital laser cutting and creasing capabilities.
THIMM packndisplay in the Czech Republic was one of Highcons first Beam 2C customers for digital cutting and creasing for corrugated packaging and display. Since commencing its operation, early this year, THIMM have been actively promoting the advantages of the digital technology among its customers through multiple channels.
Martin Hejl, Managing Director, THIMM packndisplay said: “We are proud to have received so many awards for our products. The introduction of the Highcon machine for the production of packaging, displays and decorative backdrops is particularly suitable today when the ability to go to production with no need for a traditional die-cutting tool allows us flexibility in our scheduling as well as performance benefits due to the precision of the laser cutting and digitally driven physical creasing. We believe that this digital technology is definitely on its way to make a marked positive impact on the way packaging and display products are being designed, ordered, manufactured and delivered to the marketplace.
Shlomo Nimrodi, CEO Highcon Systems added: “Thimm is a very innovative company and we feel honored to have the opportunity to work with them on driving this industry change. It has been really gratifying to see the advantages of our technology translate not only into profitable business and satisfied customers for our customers but also into well-deserved awards. THIMM have truly demonstrated the capability of the Highcon Beam 2C to differentiate their products and engage with their customers, delivering what they need, when they need in whatever quantities they need”