Business News

Epson Acquires Shinko Sellbic and its Compact Injection Molding Technology

Monday 04. June 2018 - Seeks to accelerate manufacturing process innovation, and change the future of manufacturing

Seiko Epson Corporation (TSE: 6724, “Epson”) has acquired all outstanding shares of Shinko Sellbic Co., Ltd., making it a wholly owned subsidiary.
Shinko Sellbic, which began as a plastic mold and die manufacturer, has grown to become primarily a manufacturer of desktop compact injection molding machines and their parts. Their high-performance injection molding machines feature an original flat design that makes them small and light while providing the superior injection control needed for high-quality precision parts. Shinko Sellbic also has a portfolio of other proprietary manufacturing technologies, including an ultra-compact hot runner system with a unique nozzle design that reduces costs, saves space, and realizes runnerless (waste-free) molding.
Epson’s goal in the robotics field, as stated in the Epson 25 Corporate Vision, is to refine its core manufacturing technologies that combine efficient, compact, and precision technologies along with sensing and smart technologies. We are also looking to accelerate manufacturing process innovation and change the future of manufacturing by strengthening our manufacturing infrastructure through greater efficiency and advances on the factory floor and in production management. Original core technology like Shinko Sellbic’s compact injection molding technology will play an important role in achieving this.
By making Shinko Sellbic a wholly owned subsidiary and by combining the technologies of both companies, Epson will accelerate the innovation of manufacturing processes.